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Mergers & Acquisitions
2026-03-30
Mitsubishi Electric Corp, Toshiba Corp and Rohm Co said Friday they have agreed under a memorandum of understanding to begin talks on merging their power semiconductor businesses.
In March 2024, Rohm announced discussions with Toshiba for a merger of its power semiconductor unit with that of Toshiba Electronic Devices & Storage Corp, with the two companies aiming to leverage their strengths in power chips for vehicles.
Mitsubishi Electric, which specializes in industrial-based power semiconductors, subsequently joined the integration talks.
Power chips can be used in a wide range of applications, from electric infrastructure to servers for data centers needed for artificial intelligence.“The proposed integration will create a global competitive business in terms of both scale and technology,” Mitsubishi Electric said in a press release.
The move is expected to serve as a counterweight to potential takeover efforts by Denso Corp., which agreed in September 2024 with Rohm to consider a semiconductor partnership and later acquired a 5 percent stake in the Kyoto-based chipmaker.
The major auto parts maker was considering making a tender offer to acquire all remaining outstanding Rohm shares, according to sources.